The U.S. Department of Commerce announced that it will provide a subsidy of US $ 6.6 billion (about S $ 8.9 billion) and a low -interest loan of US $ 6.6 billion (about S $ 8.9 billion), which will be used to build Arizona.Advanced semiconductor factory.
According to Reuters on Monday (April 8), the US Department of Commerce said that TSMC agreed to expand the amount of investment in the plan, which increased another $ 25 billion, with a total amount of US $ 65 billion, and it will be 2030 before 2030.The third wafer factories were built in Arizona.
TSMC will produce the world's most advanced 2 -nano -chip in the second wafers in Arizona. It is expected to begin production in 2028.
The US Department of Commerce said that the investment amount of $ 65 billion is the largest foreign direct investment in the new project in the history of the United States. It is expected that 6,000 direct manufacturing work and 20,000 construction work opportunities will be created.In addition, the 14 direct suppliers of TSMC also planned to build or expand factories in the United States.
TSMC's three wafer fabry in Arizona will produce tens of millions of 5G or 6G smartphones, autonomous vehicles and artificial intelligence data center servers.Important customers such as We semiconductor company and Qualcomm provide support.
Minister of Commerce Raymond said, "These chips are the backbone of artificial intelligence and necessary parts to support the economy."
Earlier, the US Department of Commerce announced last month that it will provide Intel with $ 8.5 billion in funding and up to $ 11 billion in loans to subsidize the production of cutting -edge chips in the same project.
