China High -tech Enterprise Huagong Technology has created China's first core component of high -end wafer laser cutting equipment.
"China Optics Valley" WeChat public account on Tuesday (July 11) announced the above news.
Huang Wei, director of the product of Huagong Laser Semiconductor, said that the thermal impact of mechanical cutting and the width of the collapsed edge are about 20 microns, and the traditional laser is about 10 microns.To higher integration, semiconductor manufacturing is more economical and efficient.
Huang Wei said that the equipment has overcome many China first in the field of semiconductor laser equipment.
The wafer cutting machine is a high -precision device that cuts the chip using mechanical or laser and other methods. It is a key link in the post -semiconductor semiconductor semiconductor.Cost of production.
According to the Sing Tao Daily, the machine is widely used in a variety of semiconductor products such as silicon -based integrated circuits, separate devices, optoelectric components, sensors, and other semiconductor products.At present, mechanical cutting applications are the most widely used, accounting for 80%of the market, mainly used for thicker wafer cutting; laser cutting is applied to thin wafer cutting, and the market accounts for 20%.
Sources said that Huagong Laser is developing the third -generation semiconductor wafer laser modified cutting equipment with industry -leading levels. It is planned to be launched in July this year.Walls laser annealing equipment.
