The Taiwan Style Circuit Manufacturing Corporation (TSMC) will set up a factory in Dresden, the capital of Saxon, Germany.In order to seek young talents in Taiwan, the German government officially established the Saxon State Science and Technology Division in Taiwan on Tuesday (September 19) in Taipei.

Comprehensive Free Times and Wind Media reported that Sakson State Technology, Culture and Tourism Division Sebastian Gemkow, Dresden University President Ursula Staudinger went to Taiwan in person to personally go to Taiwan.Attend the unveiling ceremony of the above office.Josef Goldberger, director of the Saxon Bond Science and Technology Division, also attended the ceremony.

Genkov said that this is a very important station in Germany in Taiwan. The office will be a service center for Taiwan and Saxony to exchange students.Dresden, I also look forward to attracting young people who can attract Saxon to Taiwan.

Stototorder said that the Dreson University of Science and Technology (TUD), the Saxon State Department and TSMC will sign a semiconductor talent cultivation agreement, and the first batch of students will go to Taiwan in the spring of 2024.She said that according to this agreement, 50 German students will be sent to Taiwan for half a year each year, three months in cooperative schools, and then internships in TSMC for three months.Taiwan University will be the first school to participate in this plan.

The Saxon State Science and Technology Division in Taiwan will be located in the office of the German Economic Office in Taipei to provide information for scholars in Saxon State for scholars.Establish a consultation window and represent all higher education institutions in Saxonym to deal with school consulting and other businesses.

TSMC announced on August 8 that three German companies with Bosch, Infineon and NXP jointly established the European Semiconductor Manufacturing Corporation (ESMC), and in the capital of Saxon StateDresden has a factory, which is expected to begin construction in late 2024, and start production in 2027. The monthly production capacity is about 40,000 pieces of 12 -inch wafers.